LinkSwitch-HP

Energy Efficient, High-Power Off-Line Switcher with Accurate Primary-Side Regulation (PSR)

Typical Application Schematic

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LinkSwitch-HP Data Sheet

Energy Efficient, High-Power Off-Line Switcher with Accurate Primary-Side Regulation (PSR)

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The LinkSwitch™-HP family of flyback power supply ICs incorporate a primary side regulated (PSR) controller and high-voltage power MOSFET in a single package. The IC family includes devices optimized for constant voltage (CV) operation at power ranges from 9W to 90 W. LinkSwitch-HP IC controller features +/-5% CV accuracy, selectable current limit, programmable latching or hysteretic OVP, UVP and OTP, improved overload power compensation over line, fast AC reset, and programmable shutdown delay time.

Product Highlights

EcoSmart™ - Energy Efficient

Multi-mode control maximizes efficiency over full load range
No-load consumption below 30 mW at 230 VAC
>75% efficiency with 1 W input at 230 VAC
>50% efficiency with 0.1 W input at 230 VAC

High Design Flexibility for Low System Cost

Dramatically simplifies power supply designs
132 kHz operation reduces transformer and power supply size
Accurate programmable current limit
Frequency jittering reduces EMI filter cost
Fully integrated soft-start for minimum start-up stress
725 V MOSFET simplifies meeting derating requirements (LNK677x)
650 V MOSFET for lowest system cost (LNK676x/LNK666x)
Fast transient response family option (LNK666x)

Extensive Protection Features

Output short-circuit protection (SCP)
Ouput overload/over-current protection (OPP, OCP)
Optional extended shutdown delay time
Output overvoltage protection (OVP), hysteretic or latching
Line brown-in/out protection (line UV)
Line overvoltage (OV) shutdown extends line surge withstand
Accurate thermal shutdown (OTP), hysteretic or latching

Advanced Green Package Options

eSIP™-7C package:
- Vertical orientation for minimum PCB footprint
- Simple heat sink mounting using clip or adhesive pad
eSOP™-12B package:
- Low profile surface mounted for ultra-slim designs
- Heat transfer to PCB via exposed pad and SOURCE pins
- Supports either wave or IR reflow soldering
eDIP™-12B package:
- Low profile through-hole mounted for ultra-slim designs
- Heat transfer to PCB via exposed pad or optional metal heat sink
Extended creepage to DRAIN pin
Heat sink is connected to SOURCE for low EMI
Halogen free and RoHS compliant

Applications

LCD Monitor and TV
Adapter
Appliances
Industrial

Applications

Power Table

Output Power (Watts)
PRODUCT³	Heat Sink	230 VAC ±15%		85-265 VAC
PRODUCT³	Heat Sink	Adapter	Open Frame	Adapter	Open Frame
LNK6xx3K/V	PCB-W¹	15	25	9	15
LNK6xx3K	PCB-R²	21	35	12	21
LNK6xx3E	Metal	21	35	13	27
LNK6xx4K/V	PCB-W¹	16	28	11	20
LNK6xx4K	PCB-R²	22	39	15	28
LNK6xx4E	Metal	30	47	20	36
LNK6xx5K/V	PCB-W¹	19	30	13	22
LNK6xx5K	PCB-R²	26	42	18	31
LNK6xx5E	Metal	40	59³	26	45
LNK6xx6K/V	PCB-W¹	21	34	15	26
LNK6xx6K	PCB-R²	30	48	22	37
LNK6xx6E	Metal	60	88³	40	68³
LNK6xx7K/V	PCB-W¹	25	41	19	30
LNK6xx7K	PCB-R²	36	59	27	43
LNK6xx7E	Metal	85³	117³	55	90³
LNK6xx8K/V	PCB-W¹	29	47	21	34
LNK6xx8K	PCB-R²	41	68	30	48
LNK6xx8E	Metal	98³	135³	63³	104³
LNK6xx9K/V	PCB-W¹	33	54	25	39
LNK6xx9K	PCB-R²	47	77	36	56
LNK6xx9E	Metal	111³	153³	72³	118³

Notes:

PCB heat sink with wave soldering.
PCB heat sink with IR reflow soldering (exposed pad thermally connected to PCB).
Maximum power specified based on proper thermal dissipation.
Packages: E: eSIP-7C, K: eSOP-12B, V: eDIP-12B. See Table 2 in datasheet for all device options.