Energy Efficient, High-Power Off-Line Switcher with Accurate Primary-Side Regulation (PSR)
Typical Application Schematic
Data Sheets
LinkSwitch-HP Data Sheet
Energy Efficient, High-Power Off-Line Switcher with Accurate Primary-Side Regulation (PSR)
ECAD Models
Product Details
The LinkSwitch™-HP family of flyback power supply ICs incorporate a primary side regulated (PSR) controller and high-voltage power MOSFET in a single package. The IC family includes devices optimized for constant voltage (CV) operation at power ranges from 9W to 90 W. LinkSwitch-HP IC controller features +/-5% CV accuracy, selectable current limit, programmable latching or hysteretic OVP, UVP and OTP, improved overload power compensation over line, fast AC reset, and programmable shutdown delay time.
Product Highlights
EcoSmart™ - Energy Efficient
- Multi-mode control maximizes efficiency over full load range
- No-load consumption below 30 mW at 230 VAC
- >75% efficiency with 1 W input at 230 VAC
- >50% efficiency with 0.1 W input at 230 VAC
High Design Flexibility for Low System Cost
- Dramatically simplifies power supply designs
- 132 kHz operation reduces transformer and power supply size
- Accurate programmable current limit
- Frequency jittering reduces EMI filter cost
- Fully integrated soft-start for minimum start-up stress
- 725 V MOSFET simplifies meeting derating requirements (LNK677x)
- 650 V MOSFET for lowest system cost (LNK676x/LNK666x)
- Fast transient response family option (LNK666x)
Extensive Protection Features
- Output short-circuit protection (SCP)
- Ouput overload/over-current protection (OPP, OCP)
- Optional extended shutdown delay time
- Output overvoltage protection (OVP), hysteretic or latching
- Line brown-in/out protection (line UV)
- Line overvoltage (OV) shutdown extends line surge withstand
- Accurate thermal shutdown (OTP), hysteretic or latching
Advanced Green Package Options
- eSIP™-7C package:
- Vertical orientation for minimum PCB footprint
- Simple heat sink mounting using clip or adhesive pad
- eSOP™-12B package:
- Low profile surface mounted for ultra-slim designs
- Heat transfer to PCB via exposed pad and SOURCE pins
- Supports either wave or IR reflow soldering
- eDIP™-12B package:
- Low profile through-hole mounted for ultra-slim designs
- Heat transfer to PCB via exposed pad or optional metal heat sink
- Extended creepage to DRAIN pin
- Heat sink is connected to SOURCE for low EMI
- Halogen free and RoHS compliant
Applications
- LCD Monitor and TV
- Adapter
- Appliances
- Industrial
Applications
Power Table
Output Power (Watts) | |||||
---|---|---|---|---|---|
PRODUCT3 | Heat Sink | 230 VAC ±15% | 85-265 VAC | ||
Adapter | Open Frame | Adapter | Open Frame | ||
LNK6xx3K/V | PCB-W1 | 15 | 25 | 9 | 15 |
LNK6xx3K | PCB-R2 | 21 | 35 | 12 | 21 |
LNK6xx3E | Metal | 21 | 35 | 13 | 27 |
LNK6xx4K/V | PCB-W1 | 16 | 28 | 11 | 20 |
LNK6xx4K | PCB-R2 | 22 | 39 | 15 | 28 |
LNK6xx4E | Metal | 30 | 47 | 20 | 36 |
LNK6xx5K/V | PCB-W1 | 19 | 30 | 13 | 22 |
LNK6xx5K | PCB-R2 | 26 | 42 | 18 | 31 |
LNK6xx5E | Metal | 40 | 593 | 26 | 45 |
LNK6xx6K/V | PCB-W1 | 21 | 34 | 15 | 26 |
LNK6xx6K | PCB-R2 | 30 | 48 | 22 | 37 |
LNK6xx6E | Metal | 60 | 883 | 40 | 683 |
LNK6xx7K/V | PCB-W1 | 25 | 41 | 19 | 30 |
LNK6xx7K | PCB-R2 | 36 | 59 | 27 | 43 |
LNK6xx7E | Metal | 853 | 1173 | 55 | 903 |
LNK6xx8K/V | PCB-W1 | 29 | 47 | 21 | 34 |
LNK6xx8K | PCB-R2 | 41 | 68 | 30 | 48 |
LNK6xx8E | Metal | 983 | 1353 | 633 | 1043 |
LNK6xx9K/V | PCB-W1 | 33 | 54 | 25 | 39 |
LNK6xx9K | PCB-R2 | 47 | 77 | 36 | 56 |
LNK6xx9E | Metal | 1113 | 1533 | 723 | 1183 |
Notes:
- PCB heat sink with wave soldering.
- PCB heat sink with IR reflow soldering (exposed pad thermally connected to PCB).
- Maximum power specified based on proper thermal dissipation.
- Packages: E: eSIP-7C, K: eSOP-12B, V: eDIP-12B. See Table 2 in datasheet for all device options.