LinkSwitch-HP

Energy Efficient, High-Power Off-Line Switcher with Accurate Primary-Side Regulation (PSR)

Typical Application Schematic

Data Sheets

ECAD Models


LinkSwitch-HP ECAD Models

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Product Details

The LinkSwitch™-HP family of flyback power supply ICs incorporate a primary side regulated (PSR) controller and high-voltage power MOSFET in a single package. The IC family includes devices optimized for constant voltage (CV) operation at power ranges from 9W to 90 W. LinkSwitch-HP IC controller features +/-5% CV accuracy, selectable current limit, programmable latching or hysteretic OVP, UVP and OTP, improved overload power compensation over line, fast AC reset, and programmable shutdown delay time.

Product Highlights

EcoSmart™ - Energy Efficient

  • Multi-mode control maximizes efficiency over full load range
  • No-load consumption below 30 mW at 230 VAC
  • >75% efficiency with 1 W input at 230 VAC
  • >50% efficiency with 0.1 W input at 230 VAC

High Design Flexibility for Low System Cost

  • Dramatically simplifies power supply designs
  • 132 kHz operation reduces transformer and power supply size
  • Accurate programmable current limit
  • Frequency jittering reduces EMI filter cost
  • Fully integrated soft-start for minimum start-up stress
  • 725 V MOSFET simplifies meeting derating requirements (LNK677x)
  • 650 V MOSFET for lowest system cost (LNK676x/LNK666x)
  • Fast transient response family option (LNK666x)

Extensive Protection Features

  • Output short-circuit protection (SCP)
  • Ouput overload/over-current protection (OPP, OCP)
  • Optional extended shutdown delay time
  • Output overvoltage protection (OVP), hysteretic or latching
  • Line brown-in/out protection (line UV)
  • Line overvoltage (OV) shutdown extends line surge withstand
  • Accurate thermal shutdown (OTP), hysteretic or latching

Advanced Green Package Options

  • eSIP™-7C package:
    • Vertical orientation for minimum PCB footprint
    • Simple heat sink mounting using clip or adhesive pad
  • eSOP™-12B package:
    • Low profile surface mounted for ultra-slim designs
    • Heat transfer to PCB via exposed pad and SOURCE pins
    • Supports either wave or IR reflow soldering
  • eDIP™-12B package:
    • Low profile through-hole mounted for ultra-slim designs
    • Heat transfer to PCB via exposed pad or optional metal heat sink
  • Extended creepage to DRAIN pin
  • Heat sink is connected to SOURCE for low EMI
  • Halogen free and RoHS compliant

Applications

  • LCD Monitor and TV
  • Adapter
  • Appliances
  • Industrial

Applications

Power Table

Output Power (Watts)
PRODUCT3Heat Sink230 VAC ±15%85-265 VAC
AdapterOpen
Frame
AdapterOpen
Frame
LNK6xx3K/VPCB-W11525915
LNK6xx3KPCB-R221351221
LNK6xx3EMetal21351327
LNK6xx4K/VPCB-W116281120
LNK6xx4KPCB-R222391528
LNK6xx4EMetal30472036
LNK6xx5K/VPCB-W119301322
LNK6xx5KPCB-R226421831
LNK6xx5EMetal405932645
LNK6xx6K/VPCB-W121341526
LNK6xx6KPCB-R230482237
LNK6xx6EMetal6088340683
LNK6xx7K/VPCB-W125411930
LNK6xx7KPCB-R236592743
LNK6xx7EMetal853117355903
LNK6xx8K/VPCB-W129472134
LNK6xx8KPCB-R241683048
LNK6xx8EMetal98313536331043
LNK6xx9K/VPCB-W133542539
LNK6xx9KPCB-R247773656
LNK6xx9EMetal111315337231183

Notes:

  1. PCB heat sink with wave soldering.
  2. PCB heat sink with IR reflow soldering (exposed pad thermally connected to PCB).
  3. Maximum power specified based on proper thermal dissipation.
  4. Packages: E: eSIP-7C, K: eSOP-12B, V: eDIP-12B. See Table 2 in datasheet for all device options.

Product Documents

Design Examples

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